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ArChine arcfluid SF 123
Solder Assist Fluid
Product description
ArChine arcfluid SF 123 is a medium viscosity, polyalkylene glycol with excellent thermal stability and water washability. It is designed for use in solder reflow fluids, fluxes, fusing fluids, and other process fluids where high temperature stability and water solubility are critical. ArChine arcfluid SF 123 does not contain any water insoluble additives which could be deposited on the circuit board during aqueous cleaning procedures. However, for applications where extended high temperature stability is needed, ArChine arcfluid SF 123 is recommended.
Product features
- Good Thermal Stability
- High Flash Point
- Excellent Water Washability
- Low Foam Tendency
- Low Odor
- High Product Clarity
ArChine arcfluid SF 123 has been found particularly useful in fusing and reflow fluids and fluxes. They are used in fusing fluxes to help transform the Sn-Pb electroplate into solder-coat during fabrication and in reflow fluids to “reflow” solder-coat and solder perform in assembly operations. In these products the SAF-24 serves to evenly distribute the activators over the surfaces to be soldered and to protect the hot solder from oxidation during heating. ArChine arcfluid SF 123 is also used as hot liquid leveling fluids to smooth solder coatings and clear plated through-holes, and as blanketing fluids to reduce dross formation on the liquid
solder.
Typical physical properties
property |
ArChine arcfluid SF 123 |
Viscosiyt (cSt at 40°C) |
123 |
(cSt at 100°C) |
17 |
Specific Gravity (20/20°C) |
1.139 |
Density (lbs/gal, 68°F) |
9.48 |
(g/cm3, 20°C) |
1.14 |
Pour Point (°F) (°C) |
23（-5） |
Flash, closed cup (°F) (°C) |
425（218） |
Flash, open cup (°F) (°C) |
515（268） |
Surface Tension (dynes/cm) |
45.5 |
Water Solubility (25°C) |
Complete (1) |
Cloud Point(°F) (°C) |
>210 （>99） |
(temperature above which a 1% aqueous solution of the product separates) |
The physical property data listed are considered to be typical properties, not specifications
Product contains small amounts of water-insoluble additives which are present to improve thermal stability.
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