|
ArChine arcfluid SF 280
Solder Assist Fluid

Product description
ArChine arcfluid SF 280 is a water soluble polyalkylene glycol-based fluid formulated with an additive package to improve the product¡¯s stability at high temperatures and to raise its flash point. It is designed for use as a component in solder reflow fluids, fluxes, fusing fluids, and other process fluids where high temperature stability and good water washability are critical.
Product features
- Good Thermal Stability
- High Flash Point
- Excellent Water Washability
- Low Foam Tendency
- Low Odor
- High Product Clarity
ArChine arcfluid SF 280 has been found particularly useful in various heat transfer and blanketing applications. It is used as a heat transfer media to fuse Sn-Pb electroplate into solder-coat during fabrication and to ¡°reflow¡± solder-coat and solder perform during assembly. As a flux component, ArChine arcfluid SF 280 aids in heat transfer and protects the solder from oxidizing. It is also used as a hot liquid leveling fluid to smooth colder coatings and clear plated through-holes, and as a blanketing fluid to reduce dross formation on the liquid solder.
Typical physical properties
Property |
ArChine arcfluid SF 280 |
Viscosity, cSt at 40¡ãC |
280 |
Specific Gravity, 20/20¡ãC |
1.088 |
Density, lbs/gal, 68¡ãF (g/cc, 20¡ãC) |
9.06 (1.086) |
Pour Point, ¡ãF (¡ãC) |
5 (-15) |
Flash Point |
|
Closed cup, ¡ãF (¡ãC) |
350 (177) |
Open cup, ¡ãF (¡ãC) 605 (318) |
605 (318) |
Surface Tension, dynes/cm |
38.7 |
Water Solubility, 25¡ãC |
Complete (1) |
Cloud Point, ¡ãF (¡ãC)(2) |
185 (85) |
(1)Product contains small amounts of water-insoluble additives which are present to improve thermal stability.
(2)Temperature above which a 1% aqueous solution of the product separates.
|
|